3 edition of Adhesion of diamond films on tungsten found in the catalog.
Adhesion of diamond films on tungsten
|Statement||by K.J. Maggs, J.W. Walkiewicz, and A.E. Clark.|
|Series||Report of investigations -- 9590., Report of investigations (United States. Bureau of Mines) -- 9590.|
|Contributions||Walkiewicz, J. W., Clark, A. E., United States. Bureau of Mines.|
|The Physical Object|
Purchase Metallurgical Coatings and Thin Films - 1st Edition. Print Book & E-Book. ISBN , Skip to content. Properties of diamond films The improvement of the adhesion strength of diamond films Wear behavior of detonation gun tungsten carbide coated steel vs. aluminum. Lai WC, Wu Y, Chang H and Lee Y. Enhancing the adhesion of diamond films on cobalt cemented tungsten carbide substrate using tungsten particles via MPCVD system. Journal of Alloys and Compounds. ; 12(12)
To enhance the adhesion of diamond thin films onto the cemented tungsten carbide substrates, other than varying process parameters, new guaranteed methods like deposition β-SiC and cobalt. Diamond film was synthesized on Co-deficient (Co content is about %) WC-Co substrate using microwave plasma chemical vapor deposition (MPCVD) equipment without special pretreatment. SEM, XRD, Rockwell-indentation test and scratch test were used to analyze the structure and morphology of the diamond film and its adhesion to the substrate.
Fabrication of Diamond Coated Micro Drills. The substrates used in this work are commercial tungsten carbide two-flute micro drills (φ = mm) which contain 6 wt % cobalt binder, as shown in Figure following surface pre-treatments for WC-Co micro drills are used before CVD process: (1) dipping the substrates in Murakami’s reagent (10 g K 3 [Fe(CN)] 6 + 10 g KOH + mL . "Diamond films were deposited on tungsten substrates and the effects of deposition parameters on adhesion were determined. The films were produced using a hot filament chemical vapor deposition system. Parameters investigated were substrate temperature and methane concentration in the feed gas. Film quality, morphology, and composition were.
Trading and exchanges
Important factors in the maximum likelihood analysis of flight test maneuvers
The silent song of Mary Eleanor
Bread of days =
Biomechanics of athletic movement
Court and social life in France under Napoleon the Third.
Introduction to computer programming with Visual Basic 6
Listen to the silence
Protective services for the elderly
Conditions for the return of displaced persons from the European Union
Gender and sexuality in online game cultures
Diamond films were deposited on tungsten substrates and the effects of deposition parameters on adhesion were determined. The films were produced using a hot filament chemical vapor deposition system. Parameters investigated were substrate temperature and methane concentration in the feed gas.
Film quality, morphology, and composition were. of interest to study the factors that affect adhesion of diamond films to carbides. Pure tungsten is useful as a substrate to effect these studies since, prior to diamond formation on the surface of a carbide-forming element such as tungsten, a carbide transition layer is formed upon which the diamond crystallites nucleate ().
Additional Physical Format: Electronic version: Maggs, K.J. Adhesion of diamond films on tungsten. [Washington, D.C.?]: U.S. Dept. of the Interior, Bureau of Mines. The tungsten particles bound with the WC-Co substrate to provide a degree of adhesion.
Clearly, distributing appropriately tungsten particles on the WC-Co substrate improves the adhesion of diamond film. When the space between tungsten particles was reduced, the adhesion of the diamond films to the WC-Co substrate considerably by: Conference: Adhesion between CVD diamond films and tungsten.
To increase the adhesion of diamond films and avoid the negative effects of using cobalt, previous treatments have employed tungsten particles to cover the surface of the 6 wt.% cobalt-cemented tungsten carbide (WC-Co) substrate.
The surface of the tungsten particles is transformed into W 2 C and WC, which attracts and traps carbon. Through the Cited by: In the wedge scratch technique introduced in this paper, thin film fine lines are scratched by a wedge-shaped diamond tip until a spallation occurs.
A near plane strain situation arises, and finite element method (FEM) analysis is applied for more accurate evaluation of the work of : M. de Bore, H. Huang, J. Nelson, F. Wang, William W Gerberich. In this study, we successfully fabricated ultrananocrystalline diamond (UNCD) films on tungsten carbide with mirror-like surface finish (R a adhesion, and exceptional tribological performance by adopting the optimized two-step pretreatment was found that the ultrasonication in Murakami reagent will substantially increase the substrate surface roughness even.
The objective of the study was to determine how the adhesion of diamond films on tungsten varied with the processing parameters, with the ultimate goal of establishing the optimum set of conditions for growing diamond films on tungsten with good adhesion.
; 18(5) Influence of Boriding Process in Adhesion of CVD Diamond Films on Tungsten Carbide Substrates formed due to cobalt migration to the surface of the sample during the heating stage, before reaching the boriding process temperature.
The sample shown in Figure 2 has a. In contrast to the films on cemented carbide, the adhesion of the film on SiAlON is relatively insensitive to the deposition temperature, as shown in Fig. The reasons for this are not yet known.
CONCLUSIONS Indentation adhesion test can be conveniently applied to evaluate the adhesion of diamond films on various substrates. Nanocrystalline diamond NCD coatings could improve the performances of cutting tools if the adhesion on cobalt-cemented tungsten carbide WC–Co substrates was optimized and maintained during diamond deposit.
In this study, a time modulated polarized growth process during diamond hot filament chemical vapor deposition (HFCVD) method was used. In this study, the diamond films are deposited on tungsten carbide substrates with 10 wt.% Co via hot filament chemical vapor deposition (HFCVD).
Amorphous SiC (a-SiC) interlayers with various thicknesses are fabricated between the diamond films and tungsten carbide substrates via precursor pyrolysis to promote the adhesion and friction performance of diamond films. Comparing the adhesion of aluminum to nanocrystalline diamond and tungsten carbide: Consequences for micromanufacturing ICOMM/4M No.
86 Vivekananda P. Adiga 1, Saahil Sanon 2, Christopher D. Torres 3, Patrick J. Heaney 4, Anirudha V. Sumant 5, Frank E. Pfefferkorn6, Robert W. Carpick7 1Vivekananda P. Adiga; Materials Science and Engineering, University of Pennsylvania, USA; e-mail:.
The nucleated diamond films were analyzed by scanning electron microscopy (SEM), energy‐dispersive spectroscopy (EDS), and automatic image analysis (AIA).
The evolution of the surface composition of cemented tungsten carbide during the early stages of diamond‐film deposition was strongly dependent on the substrate temperature. This is a simple and inexpensive filament arrangement. In addition, the problems associated with adhesion of diamond films on WC-Co substrates are amplified in dental tools due to the very sharp edges and unpredictable cutting forces.
The presence of Co, used as a binder in hard metals, generally causes poor adhesion. The results of a comparison study of continuous diamond coatings deposited on tungsten carbide-6% cobalt tool inserts using CF4, and CH4, gas sources are. As a result, diamond films on ceramics and metals tend to have residual stress in the films that often leads to spallation of the coating.
Tungsten carbide (WC) has coefficient of thermal expansion close to that of diamond, which is why diamond films are deposited on tungsten carbide substrates in a nearly stress-free condition [4,72].
While thin film growth using diamond seeds in HFCVD is widely used, the films show poor adhesion due to absence covalent bonding between substrate and the seeds. In addition, it also often encounters the contamination at the film/substrate interface in the deposited film from (i) the high-temperature carburization of tungsten (W) filament, and.
The adhesion of diamond films deposited by microwave plasma-enhanced CVD on various substrates can be quantitatively determined by an indentation method. The friction behaviors of diamond-coated cemented carbides sliding against a brass ring were studied.
The adhesion was evaluated by Rockwell indentation tests (20, 40, 60 and kg) conducted with a Brale indenter and compared to the adhesion of diamond films grown onto Co-cemented tungsten.Influence of Bonding Process in Adhesion of CVD Diamond Films on Tungsten Carbide Substrates Article (PDF Available) October with Reads How we measure 'reads'.Conference: Correlations of the growth, structure and stress with the adhesion of diamond films on tungsten.
Correlations of the growth, structure and stress with the adhesion of diamond films on tungsten. Full Record; Other Related Research.